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BIPOLAR DIGITAL INTEGRATED CIRCUIT
PB1514TU
16 GHz INPUT DIVIDE BY 8 PRESCALER IC FOR SATELLITE COMMUNICATIONS
DESCRIPTION
The PB1514TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 8 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
* Operating frequency * Low current consumption * Supply voltage * Division ratio : fin = 8 to 16 GHz : ICC = 50 mA @ VCC = 5.0 V : VCC = 4.5 to 5.5 V :8
* High-density surface mounting : 8-pin lead-less minimold
APPLICATIONS
* Point-to-point/Multi-point radios * VSAT radios
ORDERING INFORMATION
Part Number Order Number Package Markin g Supplying Form * 8 mm wide embossed taping * Pin 5, 6, 7, 8 indicates pull-out direction of tape * Qty 5 kpcs/reel
PB1514TU-E2
PB1514TU-E2-A
8-pin lead-less minimold (Pb-Free)
Note
1514
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PB1514TU
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10541EJ02V0DS (2nd edition) Date Published March 2005 CP(K)
The mark
shows major revised points. (c) NEC Compound Semiconductor Devices, Ltd. 2004, 2005
PB1514TU
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
Pin No.
Pin Name VCC1 IN GND IN OUT GND OUT VCC2
(Top View)
1 2 3 4 1/2 1/2 1/2 Regulator 8 7
1 2 3 4
6 5
5 6 7 8
SYSTEM APPLICATION EXAMPLE
LNA
Down-Converter
PB1514TU
16 GHz Prescaler 1/8
Diplexer
PLL
PA
Up-Converter
2
Data Sheet PU10541EJ02V0DS
PB1514TU
PIN EXPLANATION
Pin No. Pin Name Applied Voltage (V) 1 VCC1 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN - Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN - Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT - Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT - Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. Function and Applications
Data Sheet PU10541EJ02V0DS
3
PB1514TU
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Total Power Dissipation Thermal Resistance (junction to ground paddle) Operating Ambient Temperature Storage Temperature TA Tstg -40 to +85 -55 to +150 C C Symbol VCC PD Rth(j-c) Test Conditions TA = +25C TA = +85C TA = +85C Note Note Ratings 6 867 75 Unit V mW C/W
Note Mounted on 33 x 21 x 0.4 mm polyimide PCB, with copper patterning on both sides.
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V C
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = -40 to +85C, ZS = ZL = 50 )
Parameter Circuit Current Input Sensitivity Symbol ICC Pin1 Pin2 Output Power Pout No Signals fin = 8 to 13.5 GHz fin = 13.5 to 16 GHz fin = 8 to 16 GHz, Pin = 0 dBm Test Conditions MIN. - -2 -5 -11 TYP. 50 - - -5 MAX. 75 +6 +6 +2 Unit mA dBm dBm dBm
4
Data Sheet PU10541EJ02V0DS
PB1514TU
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
INPUT SENSITIVITY vs. FREQUENCY
15 10
Input Sensitivity Pin (dBm)
OUTPUT POWER vs. FREQUENCY
3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 5 Pin = 0 dBm
0 -5 -10 -15 -20 -25 -30 -35 5 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V
Guaranteed operating range
Output Power Pout (dBm)
5
Guaranteed operating range
10
15
20
10
15
VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 20
Frequency f (GHz)
Frequency f (GHz)
INPUT SENSITIVITY vs. FREQUENCY
15 10
Input Sensitivity Pin (dBm)
OUTPUT POWER vs. FREQUENCY
3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 VCC = 5.0 V Pin = 0 dBm Guaranteed operating range
0 -5 -10 -15 -20 -25 -30 -35 5 VCC = 5.0 V TA = -40C TA = +25C TA = +85C 10
Guaranteed operating range
Output Power Pout (dBm)
5
15
20
5
10
15
TA = -40C TA = +25C TA = +85C 20
Frequency f (GHz)
Frequency f (GHz)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
55 50
Circuit Current ICC (mA)
45 40 35 30 25 20 15 10 5 0 1 2 3 4 TA = -40C TA = +25C TA = +85C 5 6
Supply Voltage VCC (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10541EJ02V0DS
5
PB1514TU
S-PARAMETERS (TA = +25C, VCC = 5.0 V)
S11-FREQUENCY
1
2
START : 8.0 GHz STOP : 16.0 GHz
FREQUENCY S11 GHz MAG 3 4 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 0.667 0.718 0.768 0.752 0.700 0.733 0.779 0.726 0.705
ANG 70.3 57.8 51.2 46.0 36.8 38.1 34.0 27.6 20.0
5
1 : 9.0 GHz 2 : 10.0 GHz 3 : 12.0 GHz 4 : 14.0 GHz 5 : 15.0 GHz
S22-FREQUENCY
START : 1.0 GHz STOP : 2.0 GHz
FREQUENCY S22 GHz MAG 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 0.011 0.009 0.012 0.018 0.026 0.034 0.045 0.053 0.063 0.064 0.028
ANG 18.3 51.4 88.8 99.5 105.6 106.6 103.7 99.1 89.9 80.5 60.9
6
Data Sheet PU10541EJ02V0DS
PB1514TU
MEASUREMENT CIRCUIT
100 pF 5V Power Supply
10 nF
1 VCC1 100 pF 2 IN 50 3 GND 4 IN OUT GND OUT VCC2
8 7 6 50 5 100 pF 51 Spectrum Analyzer 100 pF
Signal Generator
100 pF 51
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10541EJ02V0DS
7
PB1514TU
ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD
100 pF 10 nF
1 2 3 4 8 7 6 5
100 pF
100 pF 100 pF
51
100 pF
51
Remarks 1. 33 x 21 x 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. 5. represents cutout : Through holes
8
Data Sheet PU10541EJ02V0DS
PB1514TU
PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT: mm)
(Top View)
(Bottom View)
(0.65) (0.65)
(0.6) (0.3)
0.40.1
(0.35) (0.35)
2.00.1
8
7
6
5
5
6
7
8
(0.6)
(0.5) (0.5)
(0.35)(0.35)
2.20.05
2.00.1
(0.6)
1
2
3
4
(0.25) (0.25)
0.125+0.1 -0.05
0.160.05
(0.75)
(0.75)
4
3
2
1
0.50.03
0.40.1
(1.4)
Data Sheet PU10541EJ02V0DS
9
PB1514TU
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground terminals as short as possible. (4) Bypass capacitance must be attached to VCC line. (5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PU10541EJ02V0DS
PB1514TU
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PU10541EJ02V0DS
11
PB1514TU
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
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Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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